
Ultrasonic Cleaning Services
We specialize in precision ultrasonic cleaning for complex electro-mechanical assemblies and components, delivering contamination-free results through multi-stage DI water systems and Class 100 cleanroom packaging.

Lithography, Etching and DLC capabilities
Using ICP systems to etch a range of ceramic material in 6 inch wafer form. Etch depth is controlled between 0.1 to 10.0 microns.