Glide Write has extensive experience in precision mass assembly work where placement of ceramic based micro devices must be bonded by cyanoacrylate adhesives and controlled within a tight tolerance of less than 2.54 microns in both X and Y direction.
The mechanical fixtures are maintained and verified on a routine basis to ensure consistency. The bonded devices can be air, heat or UV cured. The bond strength is controlled by the varieties of parameters including type of epoxy, cure temperature and time.
